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About F&S Bondtec Semiconductor GmbH

F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.

Products Line

  

5310

5310 Manual Ball Bonder

Manual Gold Ball … more

56XX

56XX Desktop Micro Factory

Too good to be true? All bonding technologies in a single table-top unit! Fully automatic! Our 56XX series is unique on the world market. … more

5330

5330 Thin Wire Wedge Bonder

Manual Wire Wedge Bonder 30, 45, 60 degree wire feed angle … more

57XX

5750 Large Area-Bonder

Dickdrahtbonden auf fast 1 qm … more

53XX

53XX Ball - Deep Access Bonder

Ball + Deep Access Wedge … more

58XX

Series 58

New automatic wirebonder for medium … more

5350

5350 Manual Heavy Wire Bonder

Heavy Wire Wedge … more

 

5600

5600 Pull- / Sheartester

Wire Pull, Ball Shear, Die Shear, Tweezer … more

Die-Bonder

5380

5380 Die-Bonder

Manual … more

5600C

5600C Automatic Bond Tester

Pull-/Sheartester with automatic pattern … more

 

5700C XL

5700C XL - Large Area Automatic Bondtester

Pull-/ … more