Uyemura USA is best known for its PCB surface finishes. The performance of Uyemura ENEPIG is unsurpassed in forming highly robust solder joints with lead-free SAC-type alloys. The Uyemura ENEPIG process is an excellent solution for IC package PCB substrates, particularly ceramic-based SiP products. ENEPIG is also immune to the dreaded “black pad” problem. Palladium is plated onto the electroless nickel via chemical reduction, so there is no compromise of the electroless nickel layer.
Uyemura are the world leader in electroless nickel/ immersion gold systems (“KAT”), also electroless golds, including AuBel (alkaline pH) and TMX (neutral pH) for gold wire bonding. Equally significant are Uyemura immersion silver (RGA) and immersion tins.
ENIG, ENEPIG, Electroless Gold, Immersion Silver and More
Acid Copper DC Electroplate
MEC Surface Treatments
Flip Chip Final Finishes
General Metal Finishing
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